MediaTek has unveiled the Dimensity 9600 Pro, its new flagship mobile platform, under the tagline "Cool Performance, Super Intelligence." It is the part that will sit inside the next wave of Android flagships, and the headline change is what it is built on.
The Dimensity 9600 Pro is MediaTek's first chip made on TSMC's 2nm-class (N2P) process. A smaller process generally packs more transistors into the same space and runs them more efficiently, which is where the "cool performance" claim comes from: more speed for the same heat, or the same speed for less battery.
What is inside
The processor uses an octa-core All-Big-Core layout, with two prime cores running up to 4.55GHz alongside six performance cores. There are no traditional small efficiency cores, which MediaTek says keeps heavy tasks responsive.
Graphics move to an Arm Mali-G2-Ultra GPU with hardware ray tracing and AI-assisted rendering, aimed at steadier frame rates in demanding games. For on-device AI, the chip carries a dual-NPU design that MediaTek says delivers large gains in generative-AI work: an OPPO partner document puts the improvement in large-language-model prefill at 51 percent over the previous generation.
For video and photography
On the camera side, the platform supports 4K slow-motion video at 240 frames per second, one of the specifications creators will care about most.
When Malaysia will see it
A chipset does not carry a price of its own for buyers. It reaches Malaysian shoppers inside the phones built around it, and MediaTek names the OPPO Find X10 Pro Max and the vivo X500 Pro and X500 Pro Max among the first devices to ship with the Dimensity 9600 Pro. Local pricing will be set by each phone maker when those models reach Malaysia.
Full technical detail is on MediaTek's official Dimensity 9600 Pro page. For context on the chips already in Malaysian hands, see our look at the vivo V80 Lite 5G, and on why this matters locally, Malaysia's chip exports heading past RM900 billion.
